
杨杰可靠性测试(汽车电子)
2023-03-27 15:23:27
晨欣小编
扬州扬杰电子科技股份有限公司 | |||||
长期可靠性试验测试参考表 | |||||
序号 | 试验项目 (Test Item) | 试验条件 (Condition) | 参考标准 (Reference) | 实验时间 (Time) | |
1 | 预处理 (Pre-conditioning) | Performed on surface mount devices (SMDs) prior to TC,AC, H3TRB & IOL/PTC stresses only. | JESD22-A113 | 1.Temperature Cycling:-40℃~60℃,5cycles; 2.Bake:125℃,24H; 3.Moisture Soak:85±2℃,85±5%/168h; 4.Reflow*3cycles:260℃,3cycles time 5-60min | |
2 | 高温反偏 (High Temperature Reverse Bias) | Tjmax,100%VR | JESD22-A108 | 1000Hrs | |
3 | 间歇老化 (Intermittent Operational Life ) | △Tj≥100℃,2min ON/2min OFF | MIL-STD-750 Method 1037 | 15000Cycles | |
4 | 高温高湿反偏 (High-temperature High-humidity Reverse Bias) | 85±2℃,85%±5%RH, 80%VR(Max=100V) | JESD22-A101 | 1000Hrs | |
4 alt | 高加速寿命实验 (Highly Accelerated Stress Test) | 130±2℃,85%±5%RH,OR 110±2℃,85%±5%RH 80%VR(Max=42V) | JESD22-A110 | 96Hrs OR 264Hrs | |
5 | 高温高湿 (High-temperature High-humidity storage test) | 85±2℃,85±5%RH | MIL-STD-202F METHOD-103B | 1000Hrs | |
5-1 | 物理破坏性分析 (DPA) | After H3TRB,Visual Inspection,X-RAY,De-cap for Weld,De-cap for Die | NA | 取H3TRB实验后材料48H内完成 | |
6 | 温度循环试验 (Temperature Cycling) | 150℃(+15,-0)/15min, -55℃(+0,-10)/15min | JESD22-A104 | 1000 cycles | |
6-1 | 物理破坏性分析 (DPA) | After TC,Visual Inspection,X-RAY,De-cap for Weld,De-cap for Die | NA | 取TC实验后材料48H内完成 | |
7 | 高温储存 (High Temperature Storage) | 150℃(+10,-0) | JESD22-A103 | 1000Hrs | |
8 | 低温储存 (Low Temperature storage) | -55℃ | Specification | 1000H | |
9 | 高压蒸煮 (Auto-clave) | 121℃±2℃,15 psig,100%RH | JESD22-A102 | 96Hrs | |
10 | 易焊性试验 (Solderability) | 235℃±5℃ | J-STD-002 | 3′ | |
11 | 耐焊接热 (Resistance to solder heat) | DIP:270±5℃ SMD: 260℃(+5,-0) | JESD22-B106 JESD22-A111 | DIP:7′(+2, -0) SMD :10' | |
12 | 弯曲牢度 (Bending Strength) | φ0.6mm~0.78mm W=0.5Kg | 90±5° | MIL-STD-750 Method 2036 | 3Times |
>φ1.20mm W=2Kg | |||||
13 | 终端牢度 (Terminal Strength) | φ0.6mm~φ0.78mm W=1Kg | MIL-STD-750 Method 2036 | 15' | |
>φ1.20mm W=3Kg | |||||
14 | 正向浪涌试验 (Forward Surge Test) | 8.3ms,Single,Half-Wave | MIL-STD-750 Method 4066 | 5Times | |
15 | 盐雾试验 (Salt Spray Test) | 试验温度:35±2℃,,氯化钠盐水浓度:5±0.1%, PH值范围:6.5-7.2,沉降率:1~2ml/80cm².h | GB/T 2423.17-2008 | 24H | |
16 | 静电测试 (ESD) | HBM:100pF,1500Ω ,GPP:4KV; Others:2KV; MM:200pF,0Ω ,400V | AEC-Q101-001/002 | 1cycle | |
17 | 高温Gate偏压 (High Temperature Gate Bias) | Tjmax,100%Vgs | JESD22-A108 | 1000Hrs | |